Bay Area Circuits team members have pioneered precision production of Burn-In (BIB), Highly Accelerated Stress Test (HAST) and Automatic Test Equipment (ATE) boards over the past 20 years.
- Burn-In Boards (BIB)
- Highly Accelerated Stress Test (HAST)
- Automatic Test Equipment (ATE)
These boards are high performance Printed Circuit Boards (PCBs) for the stress testing of semiconductor chips.
Here is a short list of some of our capabilities.
- High layer count (50 layers)
- Fine lines (0.002” traces & spacing)
- Small hole drilling and microvias (0.0039”)
- Electrical impedance (+/- 5%)
- Use of exotic raw materials (Polyimide, Arlon, Nelco, Rogers and VT461/VT901)
- Filled vias (proprietary conductive fill)
- Copper weights: up to 6 oz
- Large panel size (28” x 32”)
- Blind and buried vias drilling
- Multi-Lamination process
- Plating (various metal options)
- Speed, quality, reliability, know-how
Trace Width / Spacing: Min .002 traces, .002 spacing
Drilling: Min .10 mm (.0039”) holes
Impedance: Min +/- 5%
Copper Weights: ¼ oz, ½ oz, 1oz, 2 oz, 3 oz, 4 oz, 5 oz, 6 oz
Plating: Copper Plating, Nickel Plating, Solder Plating, Hard Gold Plating, Soft (Bondable) Gold Plating, Selective Gold
Plating, SMOBC / HAL, Bare Copper / Entek (OSP Plating)
Filled vias: Conductive or Non-conductive
Materials: FR4-06, FR4-08, 370HR, Nelco-29, Nelco-13, Nelco-13ep, Polyimide 85n, VT47, VT461