Thursday, August 17th

Building a Successful Multi-Layer Printed Circuit Board

Building a Successful Multi-Layer Printed Circuit Board

Printed Circuit Boards today face an ever-increasing demand in capabilities including high speed, low weight, higher component density, miniaturization, and more. Multi-layer PCBs can help meet those increased demands. A multi-layer PCB is created from two or more PCBs stacked together, although they are not simply laid one on top of the other.

Announcing the Availability of PCB Creator v3

Announcing the Availability of PCB Creator v3

We’re excited to announce the availability of PCB Creator version 3, an update to our popular, free PCB Layout and Schematic capture software! Here’s a quick Q&A that includes more details on this new release.

Design Considerations with Heavy Copper

Design Considerations with Heavy Copper

Minimum line width is one of the first questions asked of a PCB manufacturer’s capabilities, but the answer rarely includes “depending on copper weight.” To simplify your design process and avoid problems at the time of manufacturing, we will demonstrate how and why line width depends on copper weight. This brief overview gives some near-universal rules for trace width versus copper weight, along with other important considerations when using heavy… Read More

Cross Section Analysis: Inside a PCB

Cross Section Analysis: Inside a PCB

How can the internal quality of a printed circuit board be inspected and verified using cross section analysis? Recently we published an article that talked about IPC Inspection guidelines that provides an overview of the standards used in the inspection process of printed circuits boards. One of the many inspection processes that measure the quality of the circuit board is called a Cross Section Analysis or Micro-section. To complete the analysis… Read More

What is Controlled Impedance and How Is It Measured?

What is Controlled Impedance and How Is It Measured?

One of the most common examples of controlled impedance is the cable that connects the antenna to your television. That cable may be a coaxial cable consisting of a round, inner conductor, separated from the outer cylindrical conductor commonly called the shield by an insulator. The dimensions of the conductors and insulator, and the electrical characteristics of the insulator are carefully controlled in order to determine the shape, strength and… Read More

Introduction to Drilling and Vias

Introduction to Drilling and Vias

It wasn’t that long ago a printed circuit board was drilled using a simple drill press.  The operator had to manually move the panel to the correct x and y coordinate and then pull the lever to drill an individual hole.  This process was repeated over and over again until all the holes were drilled. Today, it’s not uncommon for a PCB to have more than 10,000 drill hits of… Read More

Printed Circuit Board Finishes

Printed Circuit Board Finishes

Applying the surface finish is one of the last steps of manufacturing a printed circuit board. The surface finish is designed to prevent oxidation of the remaining exposed copper, while the soldermask covers the majority of the circuitry. This is important because oxidized copper cannot be soldered. In rare instances, when a printed circuit board requires “body gold,” the finish is applied to the copper prior to the soldermask process.… Read More

Lamination and Drill of Printed Circuit Boards

Lamination and Drill of Printed Circuit Boards

We learned how the inner core of a 4 layer PCB is processed prior to adding the outside layers in our last post. In this post we will take about the next part of our “sandwich” construction – but first, let’s start with a brief introduction of foil lamination. Foil Lamination There are a variety of ways that foil lamination is used as well as a variety of materials that… Read More

Multi Layer PCB Image Process

Multi Layer PCB Image Process

In our last post we talked about the basic material used to start the PCB manufacturing process. If we were doing a double sided board it would actually be going into drill at this part of the process. We will get to that eventually. What we are going to do is walk through the multilayer process which is a different process initially. We will pick up at drill and the… Read More