Multi Layer Stack Up’s
PCB Manufacturing Capabilities
Chances are that we can build your board. Here is a short overview of some our extended capabilities. If you do not see what your looking for just give us call.
Density – 3/3, BGA, .004″ pitch, .006″ finished holes, microvia .004″, aspect ratio 15:1
Layer Count – up to 30 layers, up to .250 thick Lead Free RoHS capable
Materials- FR4, FR406, FR408, 370HR, Rogers, Arlon, Polyimide, Nelco-13, IS410, Hybrid Capable, ITEQ180, High Copper Weight
Finish- SMOBC, HASL, White Tin, ENIG AU, Hard & Soft AU, Entek, silver and selective surface finishes
Inspection – A.O.I. , Flying Probe, Netlist Driven
Impedance control and testing
Complex machining/scoring available (Counter sinks, counter bores, plated slots/edges etc.)
Technical Services:
Design for Manufacturing (DFM) Domestic and Overseas
Design Rule Verification (DRC) Domestic and Overseas
Best Fit Manufacturing (assisting customers w/best fit material utilization)
IPC Net List Verification to your CAD Net List Data Files
Impedance Modeling
Acceptance of extended Gerber, DPF and ODB++ Date Format Files (Import & Export)
Array Panelization suggestions and documentation (PDF files)
Array Solder Paste Stencil file creation (Gerber files)
Assisting customers with selection of base materials to meet or exceed end product requirements especially when ROHS requirements are needed.