Monday, September 16th

The following standard and advanced capabilities will assist printed circuit board (PCB) designers in setting up their basic design checks. Full capabilities for printed circuit board manufacturing may extend beyond the rules below but often times involve additional processes and costs to achieve the desired results.  It is recommended that designers who require capabilities beyond what is described below contact us to help maximize the effectiveness of the design and the printed circuit board manufacturing process.

Standard CapabilityAdvanced Capability
Overview
Minimum Layer Count11
Maximum Layer Count1630
Trace/Space0.006″0.002″
Finished Hole Size0.010″0.004″
Surface FinishesHASL, ENIG, Hard Gold, Soft Gold (see all below)ENEPIG, OSP, EPIG (see all below)
MaterialsFR-4, High Temp FR-4, Isola, Rogers, see material library for allPTFE/Duroid, Polyimide, Flex, see material library for all
Controlled Impedance+/- 10%+/- 5%
Annular Ring0.006″0.003″ Mechanical, 0.001″ Laser
Outer Layers Finished Copper1.5 oz to 2 oz1 oz to 5 oz
Inner Layers Finished Copper0.5 oz to 2 oz0.3 oz to 4 oz
Soldermask ColorsGreen, Black, Blue, Red, White, Clear, CustomYellow, Custom
Silkscreen ColorsGreen, Black, Blue, Red, White, Clear, CustomYellow, Custom
Filled ViasNon-Conductive FillNon-Conductive Fill or Conductive Fill
Smallest Mechanical Drill Diameter0.010″0.004″
Smallest Laser Drill DiameterN/A0.003″
Blind ViasNoYes
Buried ViasNoYes
Aspect Ratio10:115:1
Plated Hole to Copper0.008″0.005″
Clearance – Copper to Edge of BoardOuter Layer – 0.010″
Inner Layer – 0.015″
Outer Layer – 0.005″
Inner Layer – 0.005″
Minimum Panel Size9″ x 12″8″ x 8″
Maximum Panel Size18″ x 24″24″ x 36″
Plated SlotsRoutedRouted or Nibbled
Non-Plated SlotsRoutedRouted or Nibbled
Plating in Holes0.0008″0.0015″
Web (or Mask Width)0.006″0.003″
Soldermask Swell0.003″0.001″
Silkscreen Width0.003″0.003″
Inspection & Testing Criteria
IPC Class 2YesYes
IPC Class 3NoYes
Netlist Generation and Netlist CompareYesYes
Trace / Space
Outer Layers (finished copper)1 oz. Cu – Min .005″ Trace/Space1 oz. Cu – Min .002″ Trace/Space
2 oz. Cu – Min .008″ Trace/Space2 oz. Cu – Min .006″ Trace/Space
3 oz. Cu – Min .012″ Trace/Space3 oz. Cu – Min .008″ Trace/Space
4 oz. Cu – Min .014″ Trace/Space4 oz. Cu – Min .012″ Trace/Space
5 oz. Cu – Min .016″ Trace/Space
Inner Layers0.3 oz Cu – Min .002″ Trace/Space
0.5 oz Cu – Min .005″ Trace/Space0.5 oz Cu – Min .003″ Trace/Space
1 oz. Cu – Min .006″ Trace/Space1 oz. Cu – Min .005″ Trace/Space
2 oz. Cu – Min .012″ Trace/Space2 oz. Cu – Min .008″ Trace/Space
3 oz. Cu – Min .0012″ Trace/Space
4 oz. Cu – Min .016″ Trace/Space
Drilling
Min drilled diameter, final board thickness 0.031″ or less0.008″0.004″
Min drilled diameter, final board thickness between 0.031″ and 0.062″0.010″0.006″
Min drilled diameter, final board thickness between 0.062″ and 0.093″0.012″0.010″
Min drilled diameter, final board thickness between 0.093″ and 0.125″0.015″0.012″
Min laser diameter, dielectric thickness less than or equal to 0.004″N/A0.003″
Min laser diameter, dielectric thickness between 0.004″ and 0.005″N/A0.004″
Min laser diameter, dielectric thickness between 0.005″ and 0.007″N/A0.005″
Controlled depth blind viasNoYes, max 0.75:1 aspect ratio
Pre-drilled core blind viasNoYes
Sublamination blind viasNoYes
Build-up technologyNoUp to 4-N-4, Anylayer
Buried viasNoYes
Filled viasNon-Conductive fillNon-Conductive or Conductive fill
NibblingNoYes
Largest hole0.247″ plated, 0.250″ non-platedNo maximum
SlotsPlated or non-plated, routedPlated or non-plated, routed or nibbled
Plating in holes0.0008″0.0015″
Plated hole to copper0.008″0.005″
Surface Finish
Hot Air Solder Level (HASL – Lead)YesYes
Hot Air Solder Level (HASL – Lead-Free)YesYes
Electroless Nickel Immersion Gold (ENIG)YesYes
Immersion SilverYesYes
Hard Gold Fingers with ENIGYesYes
Hard Gold Fingers with HASLYesYes
Electrolytic Hard GoldYesYes
Electrolytic Soft GoldYesYes
Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)NoYes
Organic Surface Protectant (OSP)YesYes
Bare CopperYesYes
Electroless Palladium Immersion Gold (EPIG)NoYes
Tin NickelNoYes
White TinYesYes
Carbon InkNoYes
Soldermask
ColorsGreen, Black, Blue, Red, White, Clear, CustomYellow, Custom
Finish/TextureSemi-gloss, MatteSemi-gloss, Matte
Tented ViasYesYes
Soldermask Plugged ViasYesYes
Soldermask Thickness over Copper5 micron to 25 micron5 micron to 25 micron
Soldermask Web5 mil3 mil
Soldermask Gap to Pad4 mil2 mil
Copper Ring Under Mask-Defined Pad3 mil1 mil
Peelable SoldermaskNoYes
LPI SoldermaskYesYes
Dry Film SoldermaskNoYes
Silkscreen
ColorsGreen, Black, Blue, Red, White, Clear, CustomYellow, Custom
Minimum Legend Width 3 mil 3 mil
Space between Silkscreen and Pad 5 mil 4 mil
Controlled Impedance
Layers0-10 Layers0-30 Layers
Impedance ToleranceSingle-ended +/- 10%Single-ended +/- 5%
Impedance ToleranceDifferential Pairs +/- 10%Differential Pairs +/- 5%
Impedance ToleranceCoplanar Waveguide +/- 10%Coplanar Waveguide +/- 5%
TDR TestingYes, IncludedYes, Included
Board Thickness
1-Layer or 2-LayerMin .015″ | Max .200″Min .008″ | Max .250″
4-LayerMin .020″ | Max .200″Min .015″ | Max .250″
6-LayerMin .031″ | Max .200″Min .025″ | Max .250″
8-LayerMin .047″ | Max .200″Min .031″ | Max .250″
10-LayerMin .062″ | Max .200″Min .040″ | Max .250″
12-LayerMin .062″ | Max .200″Min .047″ | Max .250″
14-LayerMin .062″ | Max .200″Min .054″ | Max .250″
16-LayerMin .062″ | Max .200″Min .062″ | Max .250″
Laminate Materials
View our Material Library for details
CNC / Routing / Score / Mechanical Rules
Router Bit Size0.078″Min 0.021″, Max. 0.078″
Spacing for Tab Rout Array0.100″
Standard V- Score Angle30°20°, 30°, 45°, 60°
V-Score DepthOne third of board thickness (min 0.010″)
Jump ScoreNoYes, overshoot up to 0.35″
Scoring DirectionVertical and HorizontalRouted Scoring
Bevel Angle20, 30, 45, or 60 Degree Gold Finger BevelMilling/Offset or Recessed Beveling
Countersinks60, 82, 90, 100 Degree Countersink **60, 82, 90, 100 Degree Countersink **
CounterboresYesYes
Edge CastellationsNoCastellated Edges Min .040″
Plated EdgesNoYes
Cross SectionLevel 1Level 1, Level 2, Level 3

 

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