Tuesday, October 17th

The following standard and advanced capabilities will assist printed circuit board (PCB) designers in setting up their basic design checks. Full capabilities for printed circuit board manufacturing may extend beyond the rules below but often times involve additional processes and costs to achieve the desired results.  It is recommended that designers who require capabilities beyond what is described below contact us to help maximize the effectiveness of the design and the printed circuit board manufacturing process.

Standard Capability Advanced Capability
Overview
Minimum Layer Count 1 1
Maximum Layer Count 16 30
Trace/Space 0.005″ 0.002″
Finished Hole Size 0.010″ 0.004″
Surface Finishes HASL, ENIG, Hard Gold, Soft Gold (see all below) ENEPIG, OSP, EPIG (see all below)
Materials FR-4, High Temp FR-4, Isola, Rogers, see material library for all PTFE/Duroid, Polyimide, Flex, see material library for all
Controlled Impedance +/- 10% +/- 5%
Annular Ring 0.006″ 0.003″ Mechanical, 0.001″ Laser
Outer Layers Finished Copper 1.5 oz to 2 oz 1 oz to 5 oz
Inner Layers Finished Copper 0.5 oz to 2 oz 0.3 oz to 4 oz
Soldermask Colors Green, Black, Blue, Red, White, Clear, Custom Yellow, Custom
Silkscreen Colors Green, Black, Blue, Red, White, Clear, Custom Yellow, Custom
Filled Vias Non-Conductive Fill Non-Conductive Fill or Conductive Fill
Smallest Mechanical Drill Diameter 0.010″ 0.004″
Smallest Laser Drill Diameter N/A 0.003″
Blind Vias No Yes
Buried Vias No Yes
Aspect Ratio 10:1 15:1
Plated Hole to Copper 0.008″ 0.005″
Clearance – Copper to Edge of Board Outer Layer – 0.010″
Inner Layer – 0.015″
Outer Layer – 0.005″
Inner Layer – 0.005″
Minimum Panel Size 9″ x 12″ 8″ x 8″
Maximum Panel Size 18″ x 24″ 24″ x 36″
Plated Slots Routed Routed or Nibbled
Non-Plated Slots Routed Routed or Nibbled
Plating in Holes 0.0008″ 0.0015″
Web (or Mask Width) 0.006″ 0.003″
Soldermask Swell 0.003″ 0.001″
Silkscreen Width 0.003″ 0.003″
Inspection & Testing Criteria
IPC Class 2 Yes Yes
IPC Class 3 No Yes
Netlist Generation and Netlist Compare Yes Yes
Trace / Space
Outer Layers (finished copper) 1 oz. Cu – Min .005″ Trace/Space 1 oz. Cu – Min .002″ Trace/Space
2 oz. Cu – Min .008″ Trace/Space 2 oz. Cu – Min .006″ Trace/Space
3 oz. Cu – Min .012″ Trace/Space 3 oz. Cu – Min .008″ Trace/Space
4 oz. Cu – Min .014″ Trace/Space 4 oz. Cu – Min .012″ Trace/Space
5 oz. Cu – Min .016″ Trace/Space
Inner Layers 0.3 oz Cu – Min .002″ Trace/Space
0.5 oz Cu – Min .005″ Trace/Space 0.5 oz Cu – Min .003″ Trace/Space
1 oz. Cu – Min .006″ Trace/Space 1 oz. Cu – Min .005″ Trace/Space
2 oz. Cu – Min .012″ Trace/Space 2 oz. Cu – Min .008″ Trace/Space
3 oz. Cu – Min .0012″ Trace/Space
4 oz. Cu – Min .016″ Trace/Space
Drilling
Min drilled diameter, final board thickness 0.031″ or less 0.008″ 0.004″
Min drilled diameter, final board thickness between 0.031″ and 0.062″ 0.010″ 0.006″
Min drilled diameter, final board thickness between 0.062″ and 0.093″ 0.012″ 0.010″
Min drilled diameter, final board thickness between 0.093″ and 0.125″ 0.015″ 0.012″
Min laser diameter, dielectric thickness less than or equal to 0.004″ N/A 0.003″
Min laser diameter, dielectric thickness between 0.004″ and 0.005″ N/A 0.004″
Min laser diameter, dielectric thickness between 0.005″ and 0.007″ N/A 0.005″
Controlled depth blind vias No Yes, max 0.75:1 aspect ratio
Pre-drilled core blind vias No Yes
Sublamination blind vias No Yes
Build-up technology No Up to 4-N-4, Anylayer
Buried vias No Yes
Filled vias Non-Conductive fill Non-Conductive or Conductive fill
Nibbling No Yes
Largest hole 0.247″ plated, 0.250″ non-plated No maximum
Slots Plated or non-plated, routed Plated or non-plated, routed or nibbled
Plating in holes 0.0008″ 0.0015″
Plated hole to copper 0.008″ 0.005″
Surface Finish
Hot Air Solder Level (HASL – Lead) Yes Yes
Hot Air Solder Level (HASL – Lead-Free) Yes Yes
Electroless Nickel Immersion Gold (ENIG) Yes Yes
Immersion Silver Yes Yes
Hard Gold Fingers with ENIG Yes Yes
Hard Gold Fingers with HASL Yes Yes
Electrolytic Hard Gold Yes Yes
Electrolytic Soft Gold Yes Yes
Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) No Yes
Organic Surface Protectant (OSP) Yes Yes
Bare Copper Yes Yes
Electroless Palladium Immersion Gold (EPIG) No Yes
Tin Nickel No Yes
White Tin Yes Yes
Carbon Ink No Yes
Soldermask
Colors Green, Black, Blue, Red, White, Clear, Custom Yellow, Custom
Finish/Texture Semi-gloss, Matte Semi-gloss, Matte
Tented Vias Yes Yes
Soldermask Plugged Vias Yes Yes
Soldermask Thickness over Copper 5 micron to 25 micron 5 micron to 25 micron
Soldermask Web 5 mil 3 mil
Soldermask Gap to Pad 4 mil 2 mil
Copper Ring Under Mask-Defined Pad 3 mil 1 mil
Peelable Soldermask No Yes
LPI Soldermask Yes Yes
Dry Film Soldermask No Yes
Silkscreen
Colors Green, Black, Blue, Red, White, Clear, Custom Yellow, Custom
Minimum Legend Width  3 mil  3 mil
Space between Silkscreen and Pad  5 mil  4 mil
Controlled Impedance
Layers 0-10 Layers 0-30 Layers
Impedance Tolerance Single-ended +/- 10% Single-ended +/- 5%
Impedance Tolerance Differential Pairs +/- 10% Differential Pairs +/- 5%
Impedance Tolerance Coplanar Waveguide +/- 10% Coplanar Waveguide +/- 5%
TDR Testing Yes, Included Yes, Included
Board Thickness
1-Layer or 2-Layer Min .015″ | Max .200″ Min .008″ | Max .250″
4-Layer Min .020″ | Max .200″ Min .015″ | Max .250″
6-Layer Min .031″ | Max .200″ Min .025″ | Max .250″
8-Layer Min .047″ | Max .200″ Min .031″ | Max .250″
10-Layer Min .062″ | Max .200″ Min .040″ | Max .250″
12-Layer Min .062″ | Max .200″ Min .047″ | Max .250″
14-Layer Min .062″ | Max .200″ Min .054″ | Max .250″
16-Layer Min .062″ | Max .200″ Min .062″ | Max .250″
Laminate Materials
View our Material Library for details
CNC / Routing / Score / Mechanical Rules
Router Bit Size 0.078″ Min 0.021″, Max. 0.078″
Spacing for Tab Rout Array 0.100″
Standard V- Score Angle 30° 20°, 30°, 45°, 60°
V-Score Depth One third of board thickness (min 0.010″)
Jump Score No Yes, overshoot up to 0.35″
Scoring Direction Vertical and Horizontal Routed Scoring
Bevel Angle 20, 30, 45, or 60 Degree Gold Finger Bevel Milling/Offset or Recessed Beveling
Countersinks 60, 82, 90, 100 Degree Countersink ** 60, 82, 90, 100 Degree Countersink **
Counterbores Yes Yes
Edge Castellations No Castellated Edges Min .040″
Plated Edges No Yes
Cross Section Level 1 Level 1, Level 2, Level 3

 

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