Thursday, August 17th

Contact Information

Identification

Lead Time

Desired number of business days following order placement until order is complete.
Desired number of business days following order placement until order is complete.
Desired number of business days following order placement until order is complete.

Quantity

Desired quantity.
Desired quantity.
Desired quantity.

Basics

Width (x-axis) of the board.
Number of copper layers in the design.
Length (y-axis) of the board.
Overall board thickness (z-axis) including laminate, copper, soldermask and surface finish.

Details

Material that provides insulation between layers and rigidity to the board.
Minimum amount of copper thickness on external layers including material and plating.
Smallest drilled hole needed for this design.
Sides of the board to which a protective coating is applied to prevent solder bridging or oxidation of the copper.
Color of the protective soldermask. Standard color is green.
Desired level of inspection. Class 2 is standard.
The finish which covers exposed copper areas of the board.
Determined by Copper Weight (Outer). Example: construction of 2 oz outer will require 1 oz inner.
Determines whether boards will be individually routed or delivered in an array.
Sides of the board to which silkscreen shall be applied for component placement.
Color of the protective silkscreen. Standard color is white.

Options

Board edges requiring plating.
Control of circuit impedance including verification.
Vias that do not propagate through the entire board (blind), or, contained within internal layers (buried).
Vias to be filled with conductive paste or non-conductive epoxies.
Through-holes at edge of board so that when routed the hole is cut in half.
Includes electrical testing for continuity and isolation.
Added inspection and report against all details in fabrication notes & drawings.
Adds BAC UL marking to the board.
Board will adhere to ITAR requirements for data integrity.
If assembly is required, attach Bill of Materials (BOM) prior to submission.

Additional Information

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